Single receiving side contactless electronic module continuous manufacturing process

ABSTRACT

An electronic module ( 6 ) suitable for producing contactless cards ( 1 ) and/or contactless electronic labels, and comprising a carrier ( 10 ) for an electronic microcircuit ( 7 ) connectable to an antenna ( 2 ) to enable contactless operation of the module ( 6 ). The whole of the antenna ( 2 ) is arranged on the electronic module ( 6 ) and the turns lie in the plane of the carrier substrate ( 10 ). Said electronic module ( 6 ) is useful for producing contactless cards and electronic labels.

[0001] The present invention relates to the field of portable objectssuch as, in particular, contactless electronic labels and chip cardsprovided with an electronic module comprising an integratedmicrocircuit.

[0002] The invention also relates to a process for manufacturing suchmodules and such portable objects.

[0003] Portable objects are already known in the form of contactlesscards, of ISO format, which are intended to perform various operationssuch as, for example, payment operations for transport, telephone orother services. These operations are conducted by means of remotecoupling between the card's electronic module and a receiver or readerunit. Coupling may be made in reading mode only or in reading/writingmode.

[0004] In respect of cards, it is to be noted that the invention doesnot only concern cards which operate exclusively without contact. Italso relates to mixed or hybrid cards which are able to operate in bothmodes: without and with contact. These mixed cards are intended, forexample, for operations of electronic cash dispensing type for which,after being charged with units of value (monetary units, payment unitsfor various services) they are remote debited by a certain number ofthese units of value when they are passed in the proximity of a readingterminal: this type of debiting assumes contactless operation. Ifrequired, these cards can be re-charged in a purpose-designed dispenser.

[0005] For the needs of the present disclosure, and for simplificationpurposes, contactless cards shall be construed as meaning both mixedcards and contactless cards.

[0006] Also portable items are known in the form of electronic labels,generally used for various identification or follow-up operations. Theyare made up firstly of an electronic module with a microcircuit, andsecondly of a carrier for this module associated with a coiled antennaoperating at relatively low frequency (150 Khz) and of relatively largesize in relation to the size of the module.

[0007] Such as they are currently produced, portable objects in the formof electronic labels comprise antennae having a large number of turns,often over 100, and their size makes their handling difficult,especially during the label production stages when the antenna isconnected by welding to the module's microcircuit.

[0008] Similarly, portable objects in the form of contactless cards alsohave disadvantages. Such as they are currently produced, contactlesscards are portable objects of normalized size. A usual, but in no wayrestrictive, standard for the present invention is the so-called ISO7810 standard which corresponds to a card of standard format 85 mm long,54 mm wide and 0.76 mm thick.

[0009] In most known contactless cards, each card comprises a card bodymade up of an assembly of plastic sheets and of an electronic module,embedded in this assembly, comprising an integrated circuit ormicrocircuit also called a <<chip>> connected via two connectionterminals to a coiled antenna of self-inductance type. The chip has amemory and may, in some cases, comprise a microprocessor. The size ofthe electronic module is substantially smaller than the size of thecard, the module generally being positioned in one of the corners of thecard, since the mechanical stresses exerted on the module throughbending of the card are not as high in the corners as in the centre ofthe card.

[0010] In some known contactless cards, however, provision is made inthe card body for a cavity, and provision is made for a module fittedwith a coil connected to an integrated circuit, to enable contactlessoperation of the card.

[0011] In this category of contactless cards, an assembly unit isparticularly known after DE-A-43 11 493 (AMATECH), for the production ofidentification units in card format.

[0012] According to a first embodiment, a module 21 comprises a modulecarrier 28 on which is fixed an integrated circuit chip 29. A coil 30surmounts chip 29 in such manner as to confer contactless identificationcapacity upon the module. This document specifies that the readingdistance between the module and the contactless reader is small. Also,to date no chip card using such a module with antenna has apparentlybeen marketed given the problems of cost and small range whichnecessarily arise with the described module structure.

[0013] Also, it is to be noted that in this document the antenna is inthe form of a coiled air antenna inserted over the chip which gives riseto difficulties relating to production, cost, yield and lack ofhomogeneous performance.

[0014] Also, after DE 37 21 822 C1 (PHILIPS) a chip card operatingwithout contact is known, whose design is intended to solve a problem ofpoor connection between the coil and the integrated circuit. For thispurpose, this document describes a chip card without a module, anantenna 4 being fabricated on the semiconductor itself on which anintegrated circuit 5 is made. The antenna is made at the same time asthe upper tracks of the integrated circuit so that the resultingintegrated circuit is 4×6 to 6×8 mm² carrying 20 small turns.

[0015] As a result the effective surface area of the antenna is small,which is detrimental to its range. Also, the card in accordance withthis document cannot be produced in economic manner. It is known thatthe size of an elementary semiconductor pad is one of the main costfactors for mass produced integrated circuits. In this document,however, the minimum size of the integrated circuit incorporating theantenna is of about at least 24 mm², whereas cheap contactless cardsgenerally use microcircuits of very small size, of about 1 mm².

[0016] A plurality of other processes for making contactless cards arealso known, such as those described in French patent applications madeby the same applicant and filed under numbers 95 400305.9, 95 400365.3and 95 400790.2. These patent applications all describe a contactlesscard provided with an antenna whose size is substantially the same asthat of the card and is connected to a micromodule carrying the chip.

[0017] Such antenna has the advantage of having a relatively high rangefor a given reading or writing magnetic field. The equation whichdetermines the electromotive force E appearing at the terminals of thereceiver antenna when it breaks an electromagnetic field is of thefollowing type:

E _(r) =l _(e)(K _(e) S _(e) N _(e))·(K _(r) S _(r) N _(r))/D ³  (1)

[0018] in which K is a constant, S is the surface area of an averageturn of antenna, N is the number of turns coiled to form the antenna,indices e and r represent the emitting and receiver sides respectively,and D is the reading distance, i.e. the distance between the cardantenna and the antenna of the outside reader.

[0019] To cause the circuits of the card chip to operate in order toinitialize and conduct a reading operation, voltage E must be exceed acertain threshold, which is generally in the region of 3 Volts.

[0020] It will therefore be seen that for a given reading or writingdistance D that it is sought to achieve with the contactless card, thesurface area of the average turn and/or the number N of antenna turnsneeds to be increased on the reading and/or writing side.

[0021] The efficiency of the antenna, at the chosen frequency forreading or writing, will be determined by the overvoltage coefficient ofthe antenna coil which is given by the equation:

Q=Lω/R  (2)

[0022] in which L is the coil inductance which increases with coildiameter and the number of turns, ω=2πf in which f is the readingfrequency which is fixed for a given application, and R is the electricresistance of the antenna coil, which is proportional to the length ofwire of which it is formed.

[0023] Since L and R have contrary effects on the efficiency of theantenna, they tend to offset one another so that the true efficiencyfactor of the antenna is especially related to the total surface area SNof the antenna.

[0024] For a given planar coil size, the number N of turns is limited bythe width of a turn and the space between two turns which depend uponthe technology used for fabrication.

[0025] It is therefore seen that, all other things being equal, thenatural tendency to obtain a good antenna for a contactless card, whichhas been widely used in practice, is to use on the contactless card anantenna in which the size of each turn is as close as possible to thesurface of the card. This is why the contactless cards on the marketcomprise an antenna integrated into the body of the card close to itsperiphery.

[0026] But, as experience in the manufacture of such contactless cardshas shown, this choice also leads to a certain number of disadvantages.

[0027] Handling an antenna of this size for its integration into thecard and its electric connection to the electronic module raises serioustechnical problems (as in the previously mentioned case of electroniclabels).

[0028] Despite the techniques used, card and antenna assembly oftenremain complex and costly since the electronic module and antenna coilmust be connected by means that are difficult to automate. Further, theassembly undergoes lamination which is a costly process requiring theaddition of resin to sink the coil and module in the card in such mannerthat they do not appear on the surface of the card and do not deform theupper and lower sheets used for colamination.

[0029] Also, the complexity of the process does not give yieldscomparable with those achieved for the manufacture of contact cards.This is especially so when integrating the restraints required forcertain types of card printing and the possible existence of a magneticstripe or embossing. For certain types of card printing or to make amagnetic stripe on the card, the latter must have virtually perfectplanarity with defects of less than 6 μm. For embossing, materials needto be chosen which are compatible with the card manufacturing processand the antenna must, in particular, leave free the area provided forembossing otherwise it would be damaged during embossing.

[0030] Given all these disadvantages connected with currentmanufacturing methods for contactless cards and electronic labels, whichchiefly result in high manufacturing costs, the applicant's engineersset out to determine new processes for manufacturing contactless cardsand labels able to avoid all the above-mentioned disadvantages.

[0031] More precisely, the purpose of the present invention is to makeavailable non-expensive means which may be used for the manufacture ofportable objects of chip card and/or electronic label type.

[0032] Another objective of the invention is to provide low-costmanufacturing processes for contactless cards and labels allowingreliable, quality manufacture using automated machines.

[0033] A further objective of the invention is to describe amanufacturing process which can be used to obtain perfectly planarcontactless cards.

[0034] An additional objective of the invention is to make available aprocess for manufacturing contactless cards which is compatible with allsubsequent stages of card body and antenna assembly, in particular withoffset card printing, card embossing or the depositing of a magneticstripe.

[0035] For this purpose, the invention sets forth an electronic moduleof a type that is suitable for producing contactless cards and/orcontactless electronic labels, and comprising a carrier substrate tocarry an electronic microcircuit, said electronic microcircuit beingconnectable to an antenna in such manner as to enable contactlessoperation of the module, characterized in that the antenna is whollyarranged on the module and in that it comprises turns made on the planeof the carrier substrate.

[0036] The invention therefore provides a basic part of small size whichmay be used virtually indifferently for the production of contactlesscards of usual format or small-sized electronic labels, regardless oftheir shape.

[0037] According to other advantageous characteristics of the electronicmodule of the invention:

[0038] the antenna is made up of a spiral whose outer size is in theregion of 5 to 15 mm, preferably of about 12 mm, whose ends areconnected to contacts of the electronic microcircuit,

[0039] the antenna is made up of a conductor spiral having between 6 and50 turns, each turn having a width of approximately 50 to 300 μm, thespace between two contiguous turns being of about 50 to 200 μm.

[0040] the spiral forming the antenna is, for example, of substantiallycircular outer shape, with an outer diameter of about 5 to 15 mm,preferably of about 12 mm. As variants, said spiral is of substantiallysquare outer shape, with an outer side measurement of approximately 5 to15 mm, preferably approximately 12 mm, or of substantially oval outershape having a larger measurement of approximately 15 mm and a smallermeasurement of approximately 5 mm.

[0041] the microcircuit is placed in the centre of the antenna and onthe same side of the module as the antenna, the connection terminals ofthe antenna being connected to respective corresponding contact pads ofthe module or microcircuit via conductor leads. As a variant, themicrocircuit is placed on the same side as the antenna astride thelatter's turns, the connection terminals of the antenna being connectedto respective corresponding contact pads of the module and electronicmicrocircuit via conductor leads, and an insulator being placed betweenthe microcircuit and at least the underlying area of the antenna.According to another variant of embodiment of the module, the electronicmicrocircuit is placed on the side of the module which does not carrythe antenna, the connection terminals of the antenna being connected torespective corresponding contact pads of the module or microcircuit viaconductor leads crossing over pits made in the module carrier at saidconnection terminals of the antenna.

[0042] on one face of the carrier substrate the electronic modulecomprises an antenna connected to the microcircuit, and on the otherface of the carrier substrate it comprises visible contact pads that arealso connected to the microcircuit in such manner as to obtain a hybridcard able to be read and written on via the contacts and/or the antenna.

[0043] a tuning capacitor is connected in parallel to the terminals ofthe antenna and of the electronic microcircuit, and its value is chosenso as to obtain a module operating frequency situated in a range ofapproximately 1 Mhz to 450 Mhz. In particular, the value of the tuningcapacitor is in the region of 12 to 180 picoFarad, and the operatingfrequency of the module is approximately 13.56 Mhz. Alternatively, thevalue of the tuning capacitor is in the region of 30 to 500 picoFarad,and the operating frequency of the module is approximately 8.2 Mhz. Thistuning capacitor is obtaining by depositing oxidized silicon on thesurface of the microcircuit previously coated with an insulator.

[0044] The invention also relates to a contactless card and anelectronic label comprising a small-sized electronic module with anintegrated antenna, in particular of the type described above, and torespective processes for the manufacture of a contactless card and anelectronic label of this type.

[0045] To produce a contactless card of the invention, all that isrequired is:

[0046] to cut out, from a carrier of electronic modules, a contactlessmodule provided with an antenna and a microcircuit;

[0047] to bring said module opposite an opening of substantially thesame size as the module made in a card body;

[0048] to attach said module in the opening of the card body;

[0049] To make an electronic label of the invention, it is alternativelysufficient:

[0050] to cut out, from a carrier of electronic modules, a contactlessmodule provided with an antenna and a microcircuit;

[0051] to integrate the cut-out electronic module into a protectivesupport.

[0052] Alternatively, and in even simpler manner, the inventionconsiders using the production lines of contactless cards for themanufacture of electronic labels. For this purpose, an electronic moduleneeds only to be cut out from a contactless card such as describedabove, in such manner as to leave around the electronic module some cardbody substance for the purposes of protecting the module. This techniquemay be completed by cutting out another part of the same shape, forexample from the same card, then fixing this part against the first insuch manner as to surround and protect the module.

[0053] The invention will be better understood with reference to thefollowing description given as a non-restrictive example and to theappended drawings in which:

[0054]FIG. 1 shows a contactless card of the state of the art;

[0055]FIG. 2 shows a contactless card of the invention

[0056]FIG. 3 shows a strip used for the continuous manufacture ofelectronic modules of the invention, intended for use in contactlesscards or electronic labels of the invention, and a card intended tohouse the module;

[0057]FIGS. 4A to 4G show several variants of embodiment of anelectronic module of the invention, able or intended to be incorporatedinto the body of a contactless card or into an electronic label;

[0058]FIGS. 5a to 5D show a section view of several variants ofembodiment of an electronic module provided with an antenna, accordingto the invention, and

[0059]FIG. 6 shows a section view of a module for a contact andcontactless hybrid card.

[0060]FIG. 7 shows the stages of a manufacturing process for a variantof electronic label using the electronic module of the inventions.

[0061] Similar parts are given the same reference numbers in allfigures.

[0062] Reference is made to FIG. 1 showing a diagram and plan of acontactless card 1 having the type of those actually marketed. As can beseen, antenna 2 in the form of a large-sized coil, slightly smaller thanthe size of the card, is integrated into the card body 3, and two end ofthe coil of antenna 2 are connected to supply contacts 4, 5 of anelectronic module 6 carrying an integrated microcircuit 7 also called achip.

[0063] The coil is shown to scale, except in respect of the number ofturns, only four turns being shown. To assemble such coil 2 with cardbody 3, it is required to conduct complex, costly lamination orinjection operations with the above-mentioned disadvantages. With thiskind of antenna it is possible to read card information from a distanceof 70 mm onwards at a frequency of a few Mhz.

[0064] Unlike the card in FIG. 1, the general underlying principle ofthe invention consists of no longer using the large-sized antennascurrently used for contactless cards, in order to overcome theabove-mentioned disadvantages. The invention also sets out, in order toreach the desired objectives of reliability and low manufacturing cost,to use certain principles and the production lines used for themanufacture of contact cards, such manufacture being currently wellcircumscribed and allowing low manufacturing costs to be obtained.

[0065] A diagram of the solution put forward is shown by the card 1 inFIG. 2. It consists of using a particular module 6 of chip cardcombining on one same small-sized carrier the electronic functions ofconventional chip modules, and the function of transmitting/receivingantenna for contactless transmission of information between the card andan outside reading/writing device (not shown).

[0066] The size of module 6 is compatible with known manufacturingprocesses used to manufacture contact cards, in its thickness and plane,length and width.

[0067] Obviously, for a module provided with an antenna to be feasible,the size of the antenna obtained must, contrary to the teaching of thestate of the art, be compatible with the size of the module, whilemaintaining a number of turns able to assure electromagnetictransmission at sufficient distance, in the region of a few centimeters.For this purpose, the antenna is made in the form of a spiral made up ofa group of turns lying directly on the carrier substrate andsubstantially in the same plane, which excludes air coils as taught bysome documents of the prior art mentioned above.

[0068] In order to best adapt to the shape of the module and toavailable surface area, the antenna may have an outer turn ofsubstantially square, rectangular, circular or oval shape or any othersuitable shape. The two ends of the antenna are connected to the supplyterminals of an integrated circuit, in particular a memory and/ormicroprocessor, also positioned on the module as shown under reference 7in the diagram in FIG. 2 but shown in more detail in FIGS. 4 to 6.

[0069] With reference to FIG. 3, illustrating the separation of anelectronic module of the invention from a strip 8 comprising a pluralityof modules 6 placed for example in two rows. The fabrication ofconventional electronic modules on such strips is well known as such inthe sphere of contact card production and will not therefore be furtherdescribed.

[0070] A module 6 of the invention, for example of the type comprisingan integrated circuit 7 <<astride>> the turns of an antenna 2 in squarespiral shape, is detached from strip 8 by a cutting process, for examplemechanical cutting. The cut-out module is taken by automated means thatare not shown but are known, and is brought preferably with the reverseside facing upwards (integrated circuit and antenna facing the bottom ofthe opening of the card body) opposite a blind opening 9 made in thecard body 3 of a contactless chip card 1. Attachment of module 6 inopening 9 provided is made by gluing, welding or any other appropriatemeans.

[0071] The result is a contactless card according to the inventionprovided with an antenna 2 positioned at electronic module level 6 andwhose fabrication is chiefly limited to the stages which have just beendescribed, followed, obviously, by any usual printing andpersonalisation stages.

[0072]FIGS. 4A to 4G show in more detail several module variantsintended to be integrated into cards for the production of contactlesscards, or to be integrated into a support of a different form to thecard, for example to manufacture electronic labels.

[0073] A module 6 is made up of a conventional carrier substrate 10 (inrelatively flexible film, mylar, epoxy or capton) on which is added nota coil but an antenna pattern 2 which may be made in several manners aswill be explained below. Antenna 2 is, for example, made by stampingfrom a copper sheet followed by assembly of the stamped sheet with thecarrier substrate. Carrier substrate 10 and antenna 2 are possiblyassembled in precise manner, using known substrate guiding andpositioning means.

[0074] Antenna 2 may also be obtained by photochemical etching of theantenna pattern, or by depositing metallic matter on a flexible filmforming substrate 10. The choice of a suitable carrier substrate 10 hasconsequences on the thickness of the module and is chiefly dependentupon the intended use of the module. This choice is fully within thescope of men of the art.

[0075] In one variant put forward for electronic module 6, antenna 2 ismade up of a copper stripe approximately 15 μm to 70 μm thick, made inspiral form, with spaces between the turns of the same size. Ends 11, 12of this spiral are preferably widened so as to form contact pads forconnection with microcircuit 7.

[0076] Provision is made for several variants in the respectivepositioning of the microcircuit and antenna. Under a first embodiment ofthe module 6 that is practical and uses little space (FIG. 4A) chip 7 isglued in the middle of antenna 2. FIG. 4B also shows connectingconductor leads 13, 14 to connect a respective terminal of chip 7 to acorresponding respective end 11, 12 of the antenna. For this purpose alead 15 needs to be passed above the antenna lines. For this purpose aninsulator 16 is previously deposited, in particular by screen processingbetween the corresponding stripe zone and connector lead 15.

[0077] Under another embodiment of module 6 (FIG. 4C) antenna 2 takes upthe whole side of the module and has no free space in its centre. Inthis case, the invention provides for gluing microcircuit 7 either ontothe module face with no antenna or onto the same face as the antenna(FIG. 4D), after placing an insulator (dark part 16) between antenna 2and microcircuit 7.

[0078]FIG. 4E shows a variant of electronic module 6, in which antenna 2has a round spiral shape, microcircuit 7 being positioned over the planeof the turns with interpositioning of an insulator 16. With thisconfiguration it is possible to minimize the length of connection leadsbetween the antenna and the microcircuit.

[0079]FIG. 4F illustrates an additional variant of module 6 of theinvention, particularly adapted to cases in which an elongated orrectangular module is required. In this case, the pattern of antenna 2has a substantially oblong spiral shape, microcircuit is preferablylocated in the centre of the antenna and the connections between theterminals of the microcircuit and the coil pads are made as describedfor FIG. 4B.

[0080] It is to be noted that the connection between the chip pads andthe contact terminals of the antenna may be made using a conventionalconnection technique for conductor leads, such as for example so-called<<bonding >> consisting of conductor leads welded between a pad of themicrocircuit and a respective terminal of the antenna, or using theso-called <<flip-chip >> technique consisting of adding the microcircuitonto the module substrate 10 with the face carrying the antenna andmicrocircuit glued onto the substrate. Resin protection of the contactsis then achieved using conventional processes for producing contact chipcards.

[0081]FIG. 4G gives a more detailed view of an electronic module 6 ofthe invention, on which a tuning capacitor 17 has been fabricatedastride the antenna turns, by depositing on top of insulating layer 16(shaded part). In order to connect the capacitor in parallel betweenterminals 11, 12 of antenna 2 and pads 13, 14 of the microcircuit, aterminal 18 of capacitor 17 is connected to terminal 12 and pad 14, andthe other terminal 19 of capacitor 17 is connected to terminal 11 andpad 13 via intermediate pads 20, 21 connected by an intermediateconnection 22 located between intermediate pads 20, 21 and made overinsulating layer 16 in such manner as not to short-circuit the antennaturns.

[0082] Obviously, other provisions of tuning capacitor 17 are possible.In particular, it can be integrated onto microcircuit 17 itself, at thedesign stage of the latter, which will reduce the number ofmanufacturing stages of module 6.

[0083] The antenna pattern is determined so that it will allow operationat high frequency, in the Mhz region, the value of tuning capacitor 17being chosen to obtain a determined operating frequency of antenna 2within a high frequency range of approximately 1 Mhz to 450 Mhz. In oneexample of embodiment, allowing a usual operating frequency ofapproximately 13.56 Mhz to be obtained, the value of tuning capacitor 17is in the region of 12 to 180 picoFarad. In another variant allowingoperation at 8.2 Mhz, the value of the tuning capacitor is in the regionof 30 to 500 picoFarad.

[0084]FIGS. 5 and 6 show various embodiments of module 6, shown insection view. In FIG. 5 a metal grid has been used as an antenna that iscut out and then glued onto carrier substrate 10. Mechanical cutting ofa spiral antenna is suitable for stripe widths that are not too fine,currently in the region of at least 300 μm.

[0085] In FIG. 5A, microcircuit 7 and antenna 2 are situated on the twoopposite faces of carrier substrate 10, contact terminals 11, 12 ofantenna 2 being connected to pads of the microcircuit (not shown) viaconnection leads 15 brought through pits 23 made in carrier 10.

[0086] In FIG. 5B, microcircuit 7 is on the same side as antenna 2 andis deposited over its turns with interpositioning of an insulator 16. InFIG. 5C, microcircuit 7 is placed in a cavity 25 made for this purposein carrier 10 of the module, which allows the thickness of the moduleunit 6 to be reduced. In FIG. 5D, microcircuit 7 is simply glued in thecentre of antenna 2, as is also shown in FIGS. 4A, 4B. In all cases, thewhole of the antenna is positioned on carrier substrate 10 forming partof the module, and the microcircuit is added onto this substrate andantenna structure.

[0087] It is to be noted that in order to further reduce the thicknessof module 6, it is possible to use for antenna 2, instead of a cut-outmetal grid, a grid that is etched in or deposited by metallisation orotherwise on a suitable carrier substrate 10.

[0088]FIG. 6, which is a top section view of another embodiment ofelectronic module 6, in order to obtain a hybrid contact and contactlessmodule, particularly adapted to the manufacture of hybrid cards. In thismodule, microcircuit 7 and the antenna are placed on a first face ofcarrier substrate 10 of the module, as already described in respect ofFIG. 5. Also, contacts 26, identical to contacts for contact cards, areconnected to corresponding pads of the microcircuit by conductor leads27. The microcircuit can communicate with the outside using contacts 26or antenna 2 depending upon the outside signal applied. All theeffective components for the operation of the hybrid card, includingantenna 2, are therefore arranged on a hybrid module 6 of small size,able to be inserted, i.e. to be incorporated into a card body.

[0089] Advantageously, two modules 6 of the one of the above-describedtypes, may be made side by side in the width of a standard film 10 (i.e.35 mm), but other arrangements of module 6 on a carrier strip 8 comewithin the limits of the invention. Each module 6 may then betransferred onto a card body 3 of standard ISO format using conventionalprocesses for transferring modules to card bodies, such as used for theproduction of contact cards.

[0090] Alternatively, modules 6 may be used for the production ofelectronic labels, of the type used for object identification. Ifnecessary, after being cut from carrier strip 8, modules 6 are protectedby a protective resin coating or any other suitable material, allowingsmall-sized labels to be obtained at low cost. Obviously, the modulesmay also be integrated or fixed onto different or more voluminoussupports (keys, packaging, etc.) in relation to the intendedapplication.

[0091] With reference to FIG. 7. As an interesting variant of the labelmanufacturing process, in order to take advantage of scale savings andproduction lines for contact cards, while nevertheless using modules 6of the invention, it is also possible to produce electronic labels usinga process which consists solely of the above-described cutting-out stageof electronic module 6 from a contactless card 1 incorporating suchmodule, in such manner as to leave only some card body substance aroundelectronic module 6 for the purpose of protecting module 6. In this way,from mass-produced contactless cards of the invention it is easy toobtain electronic labels having the thickness of a card but with muchmore reliable plane measurements.

[0092] In this case, however, a major disadvantage becomes apparent forcertain applications: when simply cut out from a contactless card, thelabel is only protected on one side by the very minimal protectionprovided on one side of the cavity by a veil of plastic matter a hundredor so micrometers thick, whereas the other face of the module isexposed. To remedy this drawback, it is possible in judicious manner, asshown in FIG. 7(a), to cut out from one part of card 1 which at allevents would be discarded, a first part 28 having the size of theplanned label format. Then, as shown in FIG. 7(b), this part 28 istransferred onto the face of the label on which module 6 is visible andnon-protected. Part 28 is mounted on card 1 as shown in FIG. 7(d) usingany appropriate technique, in particular by gluing or ultrasoundwelding. Finally, as shown in FIG. 7(e) a part 29, is cut out from thesame card having the same size and at the same level as part 28. In thisway a symmetrical electronic label can be obtained at low cost, of whichan enlarged diagram is given in FIG. 7(f). Obviously parts 28 and 29could be cut out separately and subsequently assembled.

[0093] Such label 30 incorporates a module 6 protected on both sides,and may be graphically personalized on both sides to produce labels thatcan be used in games or any other applications.

[0094] In respect of the performance of the modules, cards and labels ofthe invention, theoretical and practical results show that on module 6 aperforming antenna is obtained able to operate over the frequency rangeof 1 to 450 Mhz.

[0095] In order to obtain required connection performances for a givenapplication, only a sufficiently high modulation frequency needs to beused (for example 13.56 Mhz) to obtain acceptable performances atreading/writing distance.

[0096] If, for example, the frequency of 13.56 Mhz is considered, whichis frequently used in electronic cash dispensing applications, theperformances obtained are fully remarkable. A chip 7 mounted using thisprocess and associated with antenna 2, can currently achieve anoperating distance of approximately 50 mm whereas the same chip mountedwith a conventional coil of card size can reach approximately 70 to 75mm. This difference is not critical for most currently consideredcontactless applications. Also, this performance may be substantiallyimproved by working on transmission circuits and the recovery ofelectromagnetic energy of the module and outside readers.

[0097] According to one practical embodiment, the module size is in theregion of 12 mm×12 mm, but it is possible to consider slightly larger,elongated formats to increase performance, or even optimising the readerantenna or even the chip antenna itself in respect of its consumption toimprove performance and attain that of a larger antenna.

[0098] With the concept of the invention, if module 6 is used tomanufacture cards, card integrity is maintained throughout the entireproduction process. Consequently, the card body may easily be used inconventional manner to house a magnetic stripe. Also, it may be printedusing any existing processes with no particular restraints other thanthose that are known for the manufacture of a conventional card.

[0099] Also, the choice of material for the card body is in no wayrestricted: it can be adapted to the needs of various applications givenconsideration.

[0100] Consequently, the invention simultaneously solves all theabove-described disadvantages connected with the production ofcontactless modules for contactless cards, in particular in respect ofcost, space requirement, printing, compatibility with embossing or theinsertion of a magnetic stripe. The small size of the antenna bringscomparable advantages for the production of electronic labels, that arenot dependent upon the shape of a card body.

[0101] The economic advantage of the invention is undeniable; it enablesthe same production lines to be used for the production of electronicmodules with integrated antennae, and of operational, contactlesselectronic labels and cards at a fraction of the current cost ofprocesses used to produce contactless cards or labels, at every stage oftheir manufacture.

[0102] Other subsidiary advantages related to the module, thecontactless label and card of the invention and to their manufacturingprocesses lie in the fact that no antenna coil handling, no tin welding,no precise positioning of the coil and no printing before insertion arerequired.

1. Electronic module (6) suitable for producing contactless cards (1)and/or contactless electronic labels, comprising a carrier substrate(10) for an electronic microcircuit (7), said electronic microcircuit(7) being connectable to an antenna (2) to enable contactless operationof the module (6), characterized in that the whole of antenna (2) isarranged on the module and in that it comprises turns made in the planeof the carrier substrate (10).
 2. Electronic module (6) in accordancewith claim 1, characterized in that said antenna (2) is made up of aspiral whose outer size is in the region of 5 to 15 mm, preferably inthe region of 12 mm, whose end terminals (11,12) are connected tocontact pads (13,14) of the electronic microcircuit (7).
 3. Electronicmodule (6) in accordance with claim 2, characterized in that antenna (2)is made up of a conductor spiral comprising between approximately 6 andapproximately 50 turns, the width of each turn being of about 50 to 300μm, the space between two contiguous turns being in the region of 50 to200 μm.
 4. Electronic module (6) in accordance with claim 3,characterized in that the outer shape of said spiral is substantiallycircular, having an outer diameter in the region of 5 to 15 mm,preferably approximately 12 mm.
 5. Electronic module (6) in accordancewith claim 3, characterized in that the outer shape of said spiral issubstantially square, with an outer side measurement in the region of 5to 15 mm, preferably approximately 12 mm.
 6. Electronic module (6) inaccordance with claim 3, characterized in that the outer shape of saidspiral is substantially oval, having a larger measurement ofapproximately 15 mm and a smaller measurement of approximately 5 mm. 7.Electronic module (6) in accordance with any of the preceding claims,characterized in that the microcircuit (7) is placed in the centre ofantenna (2) and on the same side of module (6) as the antenna, theconnection terminals (11,12) of the antenna being connected tocorresponding, respective contact pads (13,14) of module (6) or ofmicrocircuit (7) via conductor leads (15).
 8. Electronic module (6) inaccordance with any of claims 1 to 6, characterized in that themicrocircuit (7) is placed on the same side as antenna (2) astride itsturns, the connection terminals (11,12) of the antenna being connectedto corresponding, respective contact pads (13,14) of module (6) and ofelectronic microcircuit (7) via conductor leads (15), an insulator (16)being placed between the microcircuit (7) and at least the antenna zoneunder the microcircuit.
 9. Electronic module (6) in accordance with anyof claims 1 to 6, characterized in that the electronic microcircuit (7)is placed on the side of the module (6) with no antenna, the connectionterminals (11,12) of the antenna being connected to corresponding,respective contact pads (13,14) of the module (6) or of microcircuit (7)via conductor leads (15) crossing over wells (23) made in carriersubstrate (10) of the module at the level of said connection terminals(11,12) of the antenna.
 10. Electronic module (6) in accordance with anyof the preceding claims, characterized in that a tuning capacitor (17)is connected in parallel to terminals (11, 12) of the antenna to contactpads (13,14) of the electronic microcircuit (7), the value of capacitor(17) being chosen to obtain an operating frequency for module (6) in therange of approximately 1 Mhz to 450 Mhz.
 11. Electronic module (6) inaccordance with claim 10, characterized in that the value of tuningcapacitor (17) is in the region of 12 to 180 picoFarad, and in that theoperating frequency of the module is approximately 13.56 Mhz. 12.Electronic module (6) in accordance with claim 10, characterized in thatthe value of tuning capacitor (17) is in the region of 30 to 500picoFarad, and in that the operating frequency of the module isapproximately 8.2 Mhz.
 13. Electronic module (6) in accordance with anyof claims 10 to 12, characterized in that the tuning capacitor (17) isobtained by depositing oxidized silicon on the surface of themicrocircuit (7) previously coated with an insulator (16). 14.Electronic module (6) in accordance with any of the preceding claims,characterized in that it comprises on one face of carrier (10) anantenna (2) connected to microcircuit (7), and on the other face ofcarrier (10) visible contacts (26) also connected to microcircuit (7),in such manner as to obtain a hybrid card able to be read and written onvia contacts (26) and/or antenna (2).
 15. Process for manufacturing anelectronic module (6) in accordance with any of the preceding claims,characterized in that it comprises stages consisting of: on a substratecarrier (10) making a plane spiral antenna (2) of small size providedwith connection terminals (11,12); fixing on said carrier (10) or saidantenna (2) a microcircuit (7) provided with contact pads (13,14);making the electric connection between connection terminals (11,12) ofantenna (2) and corresponding contact pads (13,14) of the microcircuit;16. Contactless card (1), comprising a card body (3), an electronicmodule (6), carrying an integrated microcircuit (7) able to beincorporated into a card body (3), and an antenna (2), characterized inthat the size of said antenna (2) is substantially smaller than the sizeof card (1), and in that antenna (2) is a substantially plane spiralantenna wholly arranged on carrier substrate (10) of electronic module(6).
 17. Contactless card (1) in accordance with claim 16, characterizedin that it is provided with an electronic module (6) in accordance withany of claims 1 to
 14. 18. Process for manufacturing a contactless card(1) in accordance with claim 16 or claim 17, characterized in that itcomprises stages consisting of: cutting out, from a carrier (8) ofelectronic modules, a contactless module (6) provided with an antenna(2) and a microcircuit (7); bringing said module (6) opposite an opening(9) of substantially the same size as the module, made in card body (3);fixing said module in the opening of the card body.
 19. Electroniclabel, especially intended for object identification, characterized inthat it comprises an electronic module (6) of small size, its largestmeasurement being in the region of 5 to 15 mm, and an electronicmicrocircuit (7), characterized in that it comprises an antenna (2) alsoof small size arranged on said electronic module.
 20. Electronic label,characterized in that it is provided with an electronic module (6) inaccordance with any of claims 1 to
 13. 21. Electronic label inaccordance with claim 19 or claim 20, characterized in that theelectronic module (6) provided with its microcircuit (7) and its antenna(2) is fixed on or integrated in a carrier, so that the label may bemade part of an object to be identified.
 22. Process for manufacturingan electronic label in accordance with any of claims 19 to 21,characterized in that it comprises stages consisting of: out of acarrier (8) of electronic modules (6) cutting out a contactless module(6) provided with an antenna (2) and a microcircuit (7); integratingsaid cut-out electronic module into a protective support.
 23. Processfor manufacturing an electronic label, characterized in that itcomprises solely the stage cosseting of cutting out an electronic module(6), in accordance with any of claims 1 to 14, from a contactless card(1) incorporating such module, in such manner as to leave some substanceof card body (3) around the electronic module (6), for the purpose ofprotecting the module.
 24. Process for manufacturing an electroniclabel, characterized in that it subsequently comprises the stagesconsisting of: cutting out from a contactless card (1) a first element(28) incorporating an electronic module (6) in accordance with any ofclaims 1 to 14, to a given shape so as to leave substance around themodule; cutting out from a card, preferably the same contactless card(1), a second element (29) having the same shape as said first element;assembling said first and second elements (28,29) in such manner thatelectronic module (6) is incorporated between said elements andprotected by the latter.